Thermally conductive potting compound resists high temperatures

MASTER BOND Supreme 121AO NASA low outgassing approved epoxy is suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature of 200-210°C, product resists temperatures up to 550°F. This system exhibits an element of toughness and is not as stiff as conventional epoxies that withstand extreme temperatures. Product has a noteworthy strength profile with a tensile modulus of 750,000 to 850,000 psi at room temperature and a compressive strength of 26,000 to 28,000 psi. Its thermal conductivity is 4-5 BTU•in/(ft2•hr•°F), and it is also electrically non-conductive. Shrinkage upon cure is exceptionally low.